Great Service leads to Great Products

YULIAN provides the best solutions

Quality Control

As our industry is fortunate enough to have an industry standard IPC spec to guide us in product quality, as a leading edge manufacturer of PCB’s we have developed many additional processes in order to assure quality that is above and beyond industry norm.

PCB total solutions

Full range products, key technology adoption, and impressive customer service, after years, YULIAN creates stable growth and outstanding reputation in the market.

design

Put on the mindset of lowering PCB cost as much as possible without making compromises of the printed quality.

Products

The main areas of application for our PCBs are: automotive, consumer electronics, communication, power supply, industrial products, and medical equipment.

Multi-Layer

High layer count PCBs, widely found in file servers, data storage, GPS technology, satellite systems, weather analysis and medical equipment are usually ≥12L with special performance requirement raw material.

HDI Printed Circuit Board

HDI, High Density Interconnect, with microvia≤0.15mm， use fine feature technology to connect components in small packages. HDI’s smaller geometry allows for higher wiring density. The electrical performance is greatly improved because of control on lower parasitic, minimal stubs, removal of decoupling capacitors and lower crosstalk. RFI and EMI is much lower due to ground planes being closer together, distributed capacitance is closer.

News

In anticipation of the coming 5G revolution, PCB materials companies are already developing substrate materials with lower dielectric constant (around 3) than that of standard FR4. Despite the higher frequency, these newer materials have less loss at 5G wireless frequencies compared to PTFE laminates. PCBs for 5G systems will require processors and power amplifiers that operate at high speed and high frequency, and variations in the output from these components can be minimized with effective thermal management. Two material properties that are of interest in 5G systems are the thermal conductivity and thermal coefficient of, which measures changes in the dielectric constant of the substrate with temperature. The heat generated by circuit operation or by ICs can lead to temperature rise which would cause the loss of dielectric performance gradually.

PCB Knowledge

Chip on board (COB) is the method of manufacturing where integrated circuits are wired and bonded directly to a printed circuit board. By eliminating the packaging of individual semiconductor devices, the completed product can be more compact, lighter, and less costly.

PCB PCBA FAQ